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3 layers circuit board VPX4500

3 layers circuit board
3 layers circuit board
3 layers circuit board
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Characteristics

Number of layers
3 layers

Description

Air-cooled and conduction-cooled options 3U format Three AcroPack slots PCIe Gen 1 interface The VPX4500 is a 3U VPX carrier for Acromag AcroPack mezzanine board modules. The carrier board provides a modular approach to system assembly since each carrier can be populated with any combination of analog input/output, digital input/output, communication, AP modules. The modularity allows the user to create a board which is customized to the application. The VPX4500 is a 3U VPX carrier for Acromag AcroPack mezzanine board modules. The carrier board provides a modular approach to system assembly since each carrier can be populated with any combination of analog input/output, digital input/output, communication, AP modules. The modularity allows the user to create a board which is customized to the application. This saves money and space; a single carrier board populated with AP modules may replace several dedicated function VPX boards. The VPX4500 carrier board provides impressive functionality at low cost. Model VPX4500E-LF is an air-cooled product that supports three AcroPack sites. Two of the sites provide field I/O connections through front panel mounted 50 pin shielded connectors. The third site provides field I/O connections through the VPX backplane. Model VPX4500-CC-LF is a conduction-cooled product that supports three AcroPack sites. Two of the sites provide field I/O connections through 50 pin ribbon cable connectors. The third site provides field I/O connections to the VPX backplane. Model VPX4500-RTM-LF is a rear transition module used with both the VPX4500-E-LF and the VPX4500-CC-LF carriers to provide access to the slot C AcroPack field I/O signals.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.