Turn up the performance, turn down the heat! GORE® Thermal Insulation is an advanced thermal management solution with a conductivity lower than air. This innovation enhances heat spreading and therefore user experience.
The demand for greater performance, functionality, and smaller form factors is increasing thermal challenges in mobile devices, particularly as many powered components are generating more heat in smaller spaces. More heat generation requires advanced thermal conductivity designs to spread heat more evenly across the surface of the device.
GORE Thermal Insulation is an innovative thermal management solution that increases design flexibility and the designer’s ability to direct heat through greater control of z-axis thermal conductivity.
Improved z-axis control means superior spreading options that enable components to:
perform at higher levels for longer periods,
accommodate shrinking form factors,
meet surface temperature requirements.
Experience and extensive testing confirm the effectiveness of GORE Thermal Insulation materials for electronics: Your customers will benefit from improved performance and an overall better user experience.
Thermal engineers use graphite, heat pipes and vapor chambers to spread and dissipate heat across a larger area to improve device performance. As thermal spreading requirements increase, these thermal designs can still fail to reduce hot spots due to insufficient thermal resistance in the z-direction, which reduces the spreading ratio and increases prevalence of hot spots.
With GORE Thermal Insulation, you can now improve the effectiveness of your thermal spreading solutions.