Microspot XRF coating thickness and materials analyzers for rapid quality control and validation testing, making it easy to get the right results in seconds.
Coating thickness and materials analysis based on X-ray fluorescence (XRF) is a widely accepted and industry-proven analytical technique, offering easy-to-use, fast and non-destructive analysis, requiring little to no sample preparation, capable of analysing solids or liquids over a wide element range from 13Al to 92U on the periodic table.
PCB / PWB finishing
The ability to control finishing processes determines the pitch, reliability and shelf life of boards. Measure electroless nickel (EN, NiP) plating thickness and composition according to IPC 4556 and IPC 4552A. Hitachi High-Tech products enable you to maintain your operations in tight tolerance to ensure high quality and avoid costly re-work.
Electric and electronic component plating
Components must be plated within specification in order to provide the desired electrical, mechanical and environmental properties. Measure small features or continuous strips using the slotted chamber of the X-Strata series products to control top, intermediate and strike layers for lead frames (leadframes), connector pins, wire and terminations.
Proportional Counter System
Element range : Ti - U
Chamber design : closed or slotted
XY stage options : fixed base, motorised
Largest sample : 500 x 400 x 150 mm
Maximum number of collimators : 4
Filters: Primary 1, Secondary (Option) 1
Smallest collimator : 0.05 mm
X-ray Station software