Epoxy adhesive KB 1031 AT-S
for aeronauticsfor bondingfor metals

epoxy adhesive
epoxy adhesive
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Chemical composition
Product applications
for aeronautics, for bonding, for metals, for plastics, glass, for ceramics
Number of components
Technical characteristics
chemical-resistant, water-resistant, high peel strength, heat-cured, thermally-conductive, electrically-conductive


Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1031 AT-S can withstand severe thermal cycling, shocks and vibrations even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +135°C. It is a phenomenal adhesive offering outstanding physical strength properties and peel strength. KB 1031 AT-S adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A and Part B have a silver – gray color. KB 1031 AT-S can be applied with minimal dripping; however it can be made more flowable by adding 5 – 10% of solvent like acetone or xylene. KB 1031 AT-S is widely used in electronics, microwave, aerospace, semiconductor among various industries. PRODUCT HIGHLIGHTS High purity silver conductive Tremendous toughness Cryogenically serviceable Exceptional peel strength Superior thermal conductivity Withstands severe shocks TYPICAL APPLICATIONS Bonding Sealing Coating


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