Epoxy adhesive EP4S-80
for aeronauticsfor bondinglow outgassing

epoxy adhesive
epoxy adhesive
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Chemical composition
Product applications
for aeronautics, for bonding
Technical characteristics
low outgassing, viscosity


Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. It is low in viscosity and flows smoothly and easily. It is not premixed and frozen and has a working life of 8-12 hours, and requires heat for curing. The cure schedule is simple and straightforward, 60 to 90 minutes at 80°C. It has superb dimensional stability, very low shrinkage upon curing, and contains no solvents or diluents. EP4S-80 bonds well to a wide variety of substrates such as metals, ceramics, composites, and many plastics. It is a high modulus, high compressive strength system. Its electrical conductivity is satisfactorily functional, with a volume resistivity between 0.02 to 0.06 ohm-cm. EP4S-80 fits very nicely in bonding, sealing and gap filling applications, particularly for static dissipation and EMI/RFI shielding. It can also be considered for specialty encapsulation type applications where electrical conductivity is desirable. This system resists water, oils and fuels. The service temperature range is -60°C to +150°C. EP4S-80 should be considered in a broad array of electronic applications including opto-electronics, acoustical, automotive systems, as well as PCB assembly. Product Advantages One component, no mixing needed Will not cure until heated Curing temperature 80°C Low viscosity Brushable Key Features Low viscosity Not premixed and frozen Good electrical conductivity NASA low outgassing


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