Metal adhesive LED422DC90

for bondingfor the aerospace industryglass

Product Description
Master Bond LED422DC90 is a one part, nanosilica based system that cures rapidly in a two tiered process. The initial step is exposure to LED light at 405 nm which induces polymerization in a cross sectional mode, 2-3 mm deep. The cure is then completed by adding heat at 90-95°C for 30-45 minutes. This special curing profile allows this product to be used for side bonding. Side bonding refers to when the LED light is applied between the two substrates rather than through one of them. This partial curing with the LED light from a side angle is in essence fixturing the substrates. This fast curing system is not oxygen inhibited. There are some variables to consider with speed of the LED curing process. These include the intensity of the light source, the thickness of the layer, and the width of the cross section that is being cured. The recommended intensity of the light source should be 2-4 watts/cm2.

LED422DC90 bonds well to a wide variety of substrates including plastics, glass and metals. The system has good chemical resistance to oil, water, fuels, and mild acids and bases. It is a reliable electrical insulator with a service temperature range of -80°F to 350°F. Additionally, it can withstand rigorous thermal cycling, mechanical shock and vibration. The special feature of LED422DC90 curing well cross sectionally combined with its secondary heat cure allows it to be used as a high strength adhesive. This specialty system has been used in the electronic, optical, electro-optical, and aerospace industries.

Product Advantages

• One component system
• Cures by LED light, UV light not required
• Uncured material readily polymerizes with heat
• Can cure in cross section 2-3 mm
• Excellent strength properties, especially lap shear

Key Features

• Fixtures rapidly with LED light
• Secondary heat cure at 90-95°C
• Can cure 2-3 mm deep or in cross section
• Formulated for “side bonding” applications

Typical Properties
Viscosity: 2,000-15,000 cps
Cure Schedule: Exposure to LED light at 405 nm which induces polymerization in a cross sectional mode, 2-3 mm deep. The cure is then completed by adding heat at 90-95°C for 30-45 minutes.
Hardness: 85-90 Shore D
Service Temperature Range: -80°F to +350°F
Refractive Index: 1.49
Tensile Modulus: 475,000-575,000 psi

Applications

• Bonding
• Sealing
• Coating
• Encapsulation
• Gap Filling

Certifications

• Meets EU Directive 2015/863 (RoHS)
• ASTM E595 Compliant (NASA Low Outgassing)

Packaging

• Can
• Syringe

Caractéristiques / spécifications techniques

• One component, nanosilica filled dual curing LED system
• Rapid fixturing with LED light, secondary cure by heat (90-95°C)
• Can cure 2-3 mm deep or in cross section
• Formulated for side bonding applications
• Viscosity: 2,000-15,000 cps
• Hardness: 85-90 Shore D
• Service temperature range: -80°F to +350°F
• Refractive index: 1.49
• Tensile modulus: 475,000-575,000 psi
• Good chemical resistance to oil, water, fuels, mild acids and bases
• Reliable electrical insulator
• Withstands thermal cycling, mechanical shock and vibration
• Used in electronic, optical, electro-optical, and aerospace industries
• Meets EU Directive 2015/863 (RoHS)
• ASTM E595 Compliant (NASA Low Outgassing)
• Available in can and syringe packaging