Board connector AdrenaLINE 224G

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Overview
TE's AdrenaLINE 224G connector portfolio is engineered for GPU module integration and optimized for high data‑rate cabled system architectures. The portfolio delivers an end‑to‑end solution comprising near‑chip connectors, cabled backplane connectors, cabled I/O connectors, Micro LGA sockets and TE in‑house 224G cable to support next‑generation data center and AI/ML deployments.

Portfolio Assets

• AdrenaLINE Catapult 224G Near Chip Socket and Mating Connector
• AdrenaLINE Slingshot 224G Cabled Backplane Connectors and R/A PCB Mate
• AdrenaLINE Fastlane 224G Cabled I/O Connectors
• AdrenaLINE Micro LGA Sockets

AdrenaLINE Fastlane Features

• Cabled I/O connectors using Twinax copper cables to interface with near‑chip connectors
• Supports industry standard form factors such as OSFP and QSFP‑DD
• Integrated connector and cage design that presses onto the host board for simplified assembly
• Auxiliary pins (power and low‑speed lines) press onto the board similar to a traditional receptacle

AdrenaLINE Slingshot Features

• Hermaphroditic mating interface designed for 224G signal integrity performance
• Operates at 224G PAM‑4 data rates with 92 Ohm impedance
• Mating force: ~1.0 N per differential pair (DP); durability: 200 mating cycles
• Optimized for cabled backplane architectures using 26–32 AWG conductors

AdrenaLINE Catapult Features

• Near‑chip connector based on uLGA socket technology
• Socketed design providing controlled signal integrity at 224G data rates
• Available differential pair configurations: 16DP, 32DP, 36DP, 40DP, 64DP
• Customization options for alternative pair counts and latching/compression mechanisms

AdrenaLINE Micro LGA Socket Features

• High‑performance signal integrity for high‑speed interfaces
• Designed for straightforward assembly and removal from the cage
• Contact pins protected within the socket housing on the board side to reduce pin damage risk during service
• Offered in standard, high and ultra‑high density variants to meet application requirements

Technical specifications

• Target data rate: 224G (PAM‑4)
• Impedance (Slingshot): 92 Ohm
• Mating force (Slingshot): ~1.0 N per DP
• Durability (Slingshot): 200 mating cycles
• Cabled backplane conductor sizes supported: optimized for 26–32 AWG
• Near‑chip socket technology: uLGA / Micro LGA
• Available differential pair configurations (Catapult): 16DP, 32DP, 36DP, 40DP, 64DP
• Form factors supported for I/O: OSFP, QSFP‑DD
• Cabling: Twinax copper cables for cabled I/O; TE in‑house 224G cable for end‑to‑end connectivity
• Connector types in portfolio: near‑chip connectors, cabled backplane, cabled I/O connectors, Micro LGA sockets