Epoxy adhesive KB 1039 CRLP

for aeronauticsfor bondingfor plastics

Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 4 – 5 hours and cures quickly at elevated temperatures. The optimal cure schedule is a room temperature set-up followed by a heat cure at 90°C for 3 – 5 hours. KB 1039 CRLP is specially formulated for use in cryogenic applications. It offers phenomenal resistance to cryogenic shocks and cycles down to 4K. Additionally it is optically clear and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition to superior electrical insulation, it also offers very good chemical resistance. This product offers first-rate optical clarity and cures rigid. KB 1039 CRLP is widely used in optical, optoelectronic, electronics and aerospace industries, where optical clarity, low outgassing and cryogenic serviceability are key requirements. PRODUCT HIGHLIGHTS Superior optical clarity Very good flow properties Withstands cryogenic shocks and cycling Outstanding mechanical strength properties Excellent electrical insulation properties Capable of passing NASA low outgassing TYPICAL APPLICATIONS Bonding Sealing Coating Potting Encapsulation