Epoxy adhesive KB 1040 P

for aeronauticsfor bondingfor metals

Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1040 P is optically clear and offers top notch light transmissions properties. It has a refractive index of 1.55. It offers an extensive serviceable temperature range of -50°C to +120°C. This phenomenal adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure. KB 1040 P adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A and Part B are clear in color. KB 1040 P is widely used in optical, optoelectronic, fiber-optic, electronics, aerospace and related industries especially when plastic substrates are being used. PRODUCT HIGHLIGHTS Superior optical clarity Excellent flow properties Outstanding adhesion to plastics Bonds without crazing or stress cracking Exceptional electrical insulation properties Stellar dimensional stability TYPICAL APPLICATIONS Bonding Sealing Coating Potting Encapsulation