Aeronautic adhesive KB 1031 AT-2LO
epoxyfor bondingfor metals

aeronautic adhesive
aeronautic adhesive
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Chemical composition
Product applications
for aeronautics, for bonding, for metals, for plastics, glass, for ceramics
Number of components
Technical characteristics
low outgassing, dimensionally stable, chemical-resistant, water-resistant, high-temperature, shear strength, high peel strength, impact-resistant, vibration-resistant, heat-cured, fast-curing, electrically insulating, thermally-conductive


Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test, unlike most flexible epoxies. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation. KB 1031 AT-2LO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, and thermal conductivity, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its remarkable performance and vacuum compatibility KB 1031 AT-2LO is widely used in electronics and related industries. PRODUCT HIGHLIGHTS Superior thermal conductivity Tremendous flexibility and elongation Cryogenically serviceable Soaring peel strength Exceptional electrical insulation properties Capable of passing NASA low outgassing TYPICAL APPLICATIONS Bonding Sealing Coating Potting Encapsulation


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