Epoxy adhesive TUF 1621 AOHT
for aeronauticsfor bondingfor metals

epoxy adhesive
epoxy adhesive
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Chemical composition
Product applications
for aeronautics, for bonding, for metals, for plastics, glass, for ceramics
Number of components
Technical characteristics
low outgassing, electrically insulating, thermally-conductive, fast-curing, heat-cured, chemical-resistant, high-temperature, shear strength, water-resistant, high peel strength


Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. TUF 1621 AOHT is thermally conductive and it can withstand very high temperatures. It offers an extensive serviceable temperature range of -70°C to +200°C. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers exceptionally high lap shear strength (> 3,300 psi). TUF 1621 AOHT adheres well to a wide variety of substrates including metals, ceramics, most plastics, rubbers and glass. In addition to superior electrical insulation, it also offers very good resistance to various chemicals, such as water, oils and fuels. Part A and Part B are off-white in color. TUF 1621 AOHT is widely used in electronic, optoelectronic, vacuum, aerospace and related industries. PRODUCT HIGHLIGHTS Superior thermal conductivity Excellent toughness Convenient 1:1 mix ratio First-rate thermal conductivity Exceptional electrical insulation properties Capable of passing NASA low outgassing TYPICAL APPLICATIONS Bonding Sealing Coating


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