Thermal cleaning system EZKT

vacuum

TESTEQ Thermal Vacuum Cleaning System for High-Precision Semiconductor Components Industry-Leading Contamination Removal for Lithography, Optics & Wafer Processing This equipment adopts an innovative inclined sealing structure (patented design-Thermal Vacuum/Lithography/UHV). Through the gravity-adaptive cover plate and double-ring sealing ring interlocking technology, it can maintain a stable vacuum level (≤10⁻⁶ Pa), solving the problem of reduced cleaning efficiency caused by sealing failure in traditional equipment. It integrates a dual-fluid spray system (sodium hydroxide + deionized water), supporting non-destructive cleaning in a high-temperature (350℃) vacuum environment, avoiding thermal stress deformation. It is suitable for the maintenance of high-precision components such as mask plates, lens groups, and vacuum pump components of lithography machines, significantly improving chip yield and equipment lifespan.