Wafer plating equipment A-52-ST-LAAS-SO

Overview
This wafer plating equipment (model A-52-ST-LAAS-SO) is a strong-agitation type developed in collaboration with LAAS (CNRS). The conventional A-52 configuration has been adapted to reduce the risk of liquid spillage at high agitation speeds, enabling more reliable operation for demanding wafer plating processes. LAAS holds technical data and research results related to the device and its operating conditions.

Partner
[Overseas Technology Partner] LAAS - CNRS (French National Centre for Scientific Research)
Provided by CNRS and the LAAS Institute, both members of the French Renatech network (as of February 2026). LAAS (Laboratory for Analysis, Systems and Architectures) is a research institute within CNRS located in Toulouse and affiliated with INSIS and INS2I.

Caractéristiques / spécifications techniques

• Model: A-52-ST-LAAS-SO
• Type: Strong agitation type wafer plating equipment
• Development: Collaboration with LAAS (CNRS)
• Design focus: Improved measures to prevent liquid spillage at high agitation speeds
• Configuration: Based on the conventional A-52 model