Design software Next-Gen Build Processor

CAD data analysisCAD data preparationfor 3D printing

Description
The Next-Gen Build Processor is a software tool for LPBF metal additive manufacturing that provides a validated workflow from design to job file preparation. Developed by Nikon SLM Solutions in partnership with Materialise, the processor handles larger datasets and complex geometries while integrating validated material parameters and enhanced toolpath strategies.

Webinar key points

• Up to 10x faster processing versus previous versions, reducing slicing time from days to hours
• Jump optimization for non-solid supports to improve printing throughput and reduce processing time
• Improved vector sorting and thermal control to enhance part quality
• Support for low-angle printing to enable new applications, better surface finish and reduced post-processing
• Optimized for Next-Gen Nikon SLM systems with improved laser allocation
• Capable of processing large datasets including implicit geometries and complex builds

Details
Date: September 22, 2026
Read time: 2 mins
Registration: Registration for this event is now closed

Technical specifications

• Product name: Next-Gen Build Processor
• Type: Software — build preparation and processing tool for LPBF metal additive manufacturing
• Developer / partners: Nikon SLM Solutions and Materialise
• Supported systems: Nikon SLM systems (optimized for Next-Gen systems)
• Performance: Up to 10x faster processing compared with previous versions
• Capabilities: Jump optimization for non-solid supports, improved vector sorting, thermal control, low-angle printing support
• Workflow: Fully validated workflow from design to job file preparation; material parameters validated by Nikon SLM Solutions
• Data handling: Built to process larger files, complex builds and implicit geometries