Epoxy adhesive Redux® 100 series
for aeronauticsfor bonding

epoxy adhesive
epoxy adhesive
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Chemical composition
Product applications
for aeronautics, for bonding


The Redux 100 series is a range of resin solutions used for protecting light alloy surfaces that have been pretreated for bonding and are to be stored temporarily before bonding is completed. A thin coating of solution applied to freshly pretreated and dried surfaces loses solvent rapidly at room temperature, sealing the surfaces from the atmosphere and protecting them from loss of pretreatment quality for storage periods of up to 3 months. The Redux 100 series is intended for use with associated Redux film adhesives, as listed below. When used with the corresponding Redux adhesive, the surface pretreatment protection does not need to be removed or cured prior to bonding. Pretreatment Joint surfaces should be prepared for bonding in accordance with the adhesive to be used. Pretreatment must be completed and the surfaces totally dry before the Redux 100 series solution is applied. For more information refer to the Redux Bonding Technology Brochure. Application A well ventilated spraying booth should be used when applying primers. When the surfaces have dried, apply the Redux 100 series solution. The most efficient and economical method of applying the solution is by spraying. Apply a light continuous coating, ensuring total coverage of the area to be protected, without producing a pronounced colour. Do not apply too much solution. A thick coating may cause a reduction in the strength of the bond by preventing proper evaporation of solvents in the solution nearest to the metal surface layer. If the solution is applied by brush or roller, extra care is needed to avoid this.


*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.