Epoxy adhesive Redux® 322
for plasticsfor aeronauticsfor bonding

epoxy adhesive
epoxy adhesive
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Characteristics

Chemical composition
epoxy
Product applications
for aeronautics, for bonding, for plastics

Description

Description Redux® 322 is a high performance modified epoxy film adhesive curing at 175°C. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 220°C for short periods, or 200°C for continuous operation. Redux® 322 is a hot melt film which is free from solvents and consequently has a very low volatile content. Features ¥ Cure at 175°C ¥ Good co-cure potential with 175°C curing prepregs ¥ Good hot lap shear performance ¥ Good high temperature performance in metal sandwich structures ¥ Low volatile content and low out gassing properties ¥ Available with or without a woven nylon carrier Applications ¥ Metal to metal bonding ¥ Sandwich constructions Pretreatment It is essential that all substrates to be used are free of contamination and are in as ideal a state for bonding as possible. As pretreatment varies significantly depending on the substrates used, please refer to the Hexcel publication Redux® Bonding Technology for optimum procedures. If there is to be a delay between the pretreatment and bonding of metals, the pretreated surface should be protected with Redux® 122 surface pretreatment protection solution to conserve the optimum bonding surface. This will enable bonding to be delayed for up to 2 months without deterioration of the pretreated surface. The correct application of Redux® 122 should not alter the bonding performance of Redux® 322 (for full application details consult the relevant data sheet). Curing Redux® 322 should be cured at 175±5°C for 60 minutes to obtain optimum properties.

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