Redux® 322 is a high performance modified epoxy film adhesive curing at 175°C. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 220°C for short periods, or 200°C for continuous operation. Redux® 322 is a hot melt film which is free from solvents and consequently has a very low volatile content.
¥ Cure at 175°C
¥ Good co-cure potential with 175°C curing prepregs
¥ Good hot lap shear performance
¥ Good high temperature performance in metal sandwich structures
¥ Low volatile content and low out gassing properties
¥ Available with or without a woven nylon carrier
¥ Metal to metal bonding
¥ Sandwich constructions
It is essential that all substrates to be used are free of contamination and are in as ideal a state for bonding as possible. As pretreatment varies significantly depending on the substrates used, please refer to the Hexcel publication Redux® Bonding Technology for optimum procedures. If there is to be a delay between the pretreatment and bonding of metals, the pretreated surface should be protected with Redux® 122 surface pretreatment protection solution to conserve the optimum bonding surface. This will enable bonding to be delayed for up to 2 months without deterioration of the pretreated surface. The correct application of Redux® 122 should not alter the bonding performance of Redux® 322 (for full application details consult the relevant data sheet).
Redux® 322 should be cured at 175±5°C for 60 minutes to obtain optimum properties.