Epoxy adhesive Redux® 319 series

for aeronauticsfor bondingfor metals

Redux® 319 is a high performance modified epoxy film adhesive curing at 175°C. It is available in both supported and unsupported versions at areal weights between 180 and 400 g/m2. The supported versions contain a woven nylon carrier for glueline thickness control and improved handleability. Redux® 319 is a hot melt film which is free from solvents and consequently it has a very low volatile content. Features Cures in 60 minutes at 175°C Good performance at temperatures ranging from -55°C to 150°C Good short-term exposure performance at 175°C Excellent peel properties Good drape at ambient temperatures Less than 1% volatile content Applications Aluminium to aluminium bonding Fibre-reinforced composite to composite bonding Aluminium honeycomb sandwich bonding Aramid honeycomb sandwich bonding Forms Grey flexible film adhesive, available unsupported or with a woven nylon carrier. Instructions For Use Pretreatment It is essential that all substrates for bonding are free of contamination and in as ideal a state as possible. As pretreatment varies significantly depending on the substrates being used, please refer to the Hexcel publication Redux® Bonding Technology for optimum procedures. If there is to be a delay between the pretreatment and bonding of aluminium, the pretreated surface should be protected with Redux® 119 surface pretreatment protection solution to conserve the optimum bonding surface.