Redux® 609 is a 120°C curing modified epoxy film adhesive containing a cotton scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 200g/m2 and 300g/m2 . An unsupported version with areal weight 300g/m2 is also available.
Flexible cure cycle
Good lap shear performance at temperatures ranging from -55°C to 80°C
Good peel properties from -55°C to 80°C
Good properties in sandwich structures from -55°C to 80°C
Good tack to assist in adhesive joint assembly
Less than 1% volatile content
Suitable for bonding a wide range of substrates
Aluminium to aluminium bonding
Sandwich bonding with a variety of skins and cores
Blue, supported, flexible film adhesive having the following dimensions:
The film is protected on one side by polythene and on the other side by release paper.
Instructions For Use
It is essential that all substrates of the final bonded structure to be used are free of contamination and in as ideal a state for bonding as possible. As pretreatment will significantly vary dependent on substrates being used, please refer to the Hexcel publication Redux® Bonding Technology for optimum procedures.
If there will be a delay between pretreatment and bonding of aluminium, the pretreated surface can be protected with Redux® 112 to conserve the good bonding surface. Bonding can be delayed for up to 2 months without deterioration of the pretreated surface.