Epoxy adhesive EP65HT-1
for aeronauticsfor bondingfor metals

epoxy adhesive
epoxy adhesive
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Chemical composition
Product applications
for aeronautics, for bonding, for metals, for plastics, glass, for ceramics, for rubber
Number of components
Technical characteristics
low outgassing, dimensionally stable, electrically insulating, fast-curing, chemical-resistant, high-temperature, shear strength, flame-retardant


EP65HT-1 Product Information Two component epoxy system featuring the special combination of very fast setup times and high temperature resistance Key Features Convenient handling, gun dispensable Cures rapidly even in small masses Meets NASA low outgassing specifications Withstands 1,000 hours 85°C/85% RH Master Bond EP65HT-1 is a specialty type system that features the unusual combination of ultra fast curing and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures (Tg) below 85°C, EP65HT-1 has an exceptional Tg of approximately 125°C. In addition, unlike typical fast cure epoxies, EP65HT-1 retains fast setup times even when mixed in relatively small masses. EP65HT-1 normally will setup in 3-5 minutes in 10-20 gram masses. A full cure generally occurs within 6-12 hours with high tensile shear strengths of over 1,200 psi. This system offers good physical properties, including low shrinkage upon cure, excellent dimensional stability and a high tensile modulus. The service temperature range is -60°F to +400°F. EP65HT-1 offers sound electrical insulating properties and a useful chemical resistance profile. EP65HT-1 fully meets the NASA low outgassing specifications and is particularly well suited for vacuum applications. EP65HT-1 bonds well to a wide variety of substrates including metals, glass, ceramics, vulcanized rubbers and many plastics. Dispensing EP65HT-1 can be greatly facilitated by utilizing a dispensing gun capable of mixing fast setting materials with a ten to one mix ratio. This system is 100% reactive and does not contain any solvents.


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