Epoxy adhesive EP3HTS-TC
for aeronauticsfor bondingfor metals

epoxy adhesive
epoxy adhesive
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Chemical composition
Product applications
for aeronautics, for bonding, for metals, for plastics, for ceramics, for composites
Number of components
Technical characteristics
low outgassing, fast-curing, thermally-conductive, electrically-conductive


One component, silver filled epoxy features extraordinary electrical and thermal conductivity. Key Features: For bonding, sealing and coating Not premixed and frozen Very long open time at room temperature Cures rapidly at 250-300°F Product Advantages: Single component system, no mixing needed Unlimited working life Ideal viscosity for die attach and general bonding Spectacular electrical and thermal conductivity NASA low outgassing


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