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Epoxy adhesive EP3HTS-TCfor aeronauticsfor bondingfor metals
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Characteristics
- Chemical composition
- epoxy
- Product applications
- for aeronautics, for bonding, for metals, for plastics, for ceramics, for composites
- Number of components
- single-component
- Technical characteristics
- low outgassing, fast-curing, thermally-conductive, electrically-conductive
Description
One component, silver filled epoxy features extraordinary electrical and thermal conductivity.
Key Features:
For bonding, sealing and coating
Not premixed and frozen
Very long open time at room temperature
Cures rapidly at 250-300°F
Product Advantages:
Single component system, no mixing needed
Unlimited working life
Ideal viscosity for die attach and general bonding
Spectacular electrical and thermal conductivity
NASA low outgassing
Catalogs
No catalogs are available for this product.
See all of Master Bond Inc.‘s catalogs
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- Electrically insulating adhesive
- Composite adhesive
- Viscosity adhesive
- Single-component adhesive
- High-temperature adhesive
- Water-resistant adhesive
- Thermally-conductive adhesive
- Dimensionally stable adhesive
- Heat-cured adhesive
- Fast-curing adhesive
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.