Epoxy adhesive EP4EN-80
for aeronauticsfor bondinglow outgassing

epoxy adhesive
epoxy adhesive
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Chemical composition
Product applications
for aeronautics, for bonding
Technical characteristics
low outgassing


Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. Free flowing EP4EN-80 is suitable for bonding, and small potting and encapsulation applications up to about a ¼ inch thick.


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