{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
... No mix, single component system Serviceability from 4K to +400°F Unlimited working life at room temperature Resistance to mechanical and thermal shocks Withstands 1,000 hours 85°C/85% RH Master Bond Supreme 10HT features a unique blend of performance ...
... a remarkable array of properties along with exceptionally simple processing. It requires no mixing, but does require oven curing at 250-300°F. First and foremost, this multifaceted epoxy is a splendid conductor of electricity. Its temperature ...
... two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at temperatures as low as 4K as an adhesive, sealant and protective ...
... achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1031 AT-S can withstand severe thermal cycling, shocks and ...
KOHESI BOND
Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher temperatures. TUF ...
KOHESI BOND
... Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy ...
KOHESI BOND
... Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable ...
KOHESI BOND
... achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1031 AT-2LO can withstand severe thermal shocks and cycling ...
KOHESI BOND
... followed by a heat cure at 70°C – 90°C for 3 – 5 hours. TUF 1621 AOHT is thermally conductive and it can withstand very high temperatures. It offers an extensive serviceable temperature range of -70°C to +200°C. This phenomenal adhesive ...
KOHESI BOND
the best suppliers